Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints

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Bibliographic Details
Main Authors: Mohd Arif Anuar, Mohd Salleh, Somidin, Flora, Mohd Mustafa Al Bakri, Abdullah, Nik Noriman, Zulkepli, Mayappan, Ramani, Noor Farhani, Mohd Alui
Other Authors: arifanuar@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34838
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