Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints
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Trans Tech Publications
2014
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my.unimap-348382014-05-29T01:54:51Z Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints Mohd Arif Anuar, Mohd Salleh Somidin, Flora Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Mayappan, Ramani Noor Farhani, Mohd Alui arifanuar@unimap.edu.my niknoriman@unimap.edu.my ramani@perlis.uitm.edu.my Hardness Lead-free composite solder Recycled-Aluminium Shear stress Link to publisher's homepage at http://www.ttp.net/ Varying amount of recycled-Aluminium (0, 3.0, 3.5 and 4.0 wt.% re-Al) particulates produced from aluminium beverage cans were successfully reincorporated into Sn-0.7Cu base matrix solder material via powder metallurgy technique. This paper focuses on the mechanical properties aspect of the new solder when joint on Cu-substrate. The hardness of the composite solders sintered bulks was enhanced with the increasing re-Al additions. Moreover, the composite solders have shown enhancement of shear stress strength at the solder joints. Fracture surface of the failure samples were analyzed using scanning electron microscope (SEM) which have indicated all samples failed under ductile fracture mechanism. However, with the refining dimples formation shown on the fractograph, this report suggests the increasing re-Al reinforcement has optimized the solder joints ductility strength. 2014-05-28T09:18:49Z 2014-05-28T09:18:49Z 2013 Article Advanced Materials Research, vol.795, 2013, pages 795.446 1662-8985 http://www.scientific.net/AMR.795.446 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34838 10.4028/www.scientific.net/AMR.795.446 en Trans Tech Publications |
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English |
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Hardness Lead-free composite solder Recycled-Aluminium Shear stress |
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Hardness Lead-free composite solder Recycled-Aluminium Shear stress Mohd Arif Anuar, Mohd Salleh Somidin, Flora Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Mayappan, Ramani Noor Farhani, Mohd Alui Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints |
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Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
arifanuar@unimap.edu.my |
| author_facet |
arifanuar@unimap.edu.my Mohd Arif Anuar, Mohd Salleh Somidin, Flora Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Mayappan, Ramani Noor Farhani, Mohd Alui |
| format |
Article |
| author |
Mohd Arif Anuar, Mohd Salleh Somidin, Flora Mohd Mustafa Al Bakri, Abdullah Nik Noriman, Zulkepli Mayappan, Ramani Noor Farhani, Mohd Alui |
| author_sort |
Mohd Arif Anuar, Mohd Salleh |
| title |
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints |
| title_short |
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints |
| title_full |
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints |
| title_fullStr |
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints |
| title_full_unstemmed |
Effects of Recycled-Aluminium additions on the mechanical properties of Sn-0.7Cu/Cu-Substrate lead-free solder joints |
| title_sort |
effects of recycled-aluminium additions on the mechanical properties of sn-0.7cu/cu-substrate lead-free solder joints |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/34838 |
| _version_ |
1643797614631583744 |
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13.214268 |