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Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method

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Main Authors:	Iziana, Yahya, Noor Asikin, Ab Ghani, Mohd Arif Anuar, Mohd Salleh, Hamidi, Abd Hamid, Zainal Arifin, Ahmad, Mayappan, Ramani
其他作者:	izianayahya@gmail.com
格式:	Article
語言:	English
出版:	Scientific.Net 2013
主題:	Lead-Free Solder Powder Metallurgy Sn-Ag-Cu Materials engineering
在線閱讀:	http://dspace.unimap.edu.my/xmlui/handle/123456789/25577
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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