Iziana, Y., & izianayahya@gmail.com. (2013). Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method. Scientific.Net.
Chicago Style CitationIziana, Yahya, and izianayahya@gmail.com. Characterization of Sn-3.5Ag-1.0Cu Lead-free Solder Prepared Via Powder Metallurgy Method. Scientific.Net, 2013.
MLA CitationIziana, Yahya, and izianayahya@gmail.com. Characterization of Sn-3.5Ag-1.0Cu Lead-free Solder Prepared Via Powder Metallurgy Method. Scientific.Net, 2013.
Warning: These citations may not always be 100% accurate.