Comments: Characterization of Sn-3.5Ag-1.0Cu lead-free solder prepared via powder metallurgy method

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Bibliographic Details
Main Authors:	Iziana, Yahya, Noor Asikin, Ab Ghani, Mohd Arif Anuar, Mohd Salleh, Hamidi, Abd Hamid, Zainal Arifin, Ahmad, Mayappan, Ramani
Other Authors:	izianayahya@gmail.com
Format:	Article
Language:	English
Published:	Scientific.Net 2013
Subjects:	Lead-Free Solder Powder Metallurgy Sn-Ag-Cu Materials engineering
Online Access:	http://dspace.unimap.edu.my/xmlui/handle/123456789/25577
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