Mechanism-based reliability model for electronic packages
Mechanism-based reliability model is different from the conventional reliability model. It is generated based on a specific failure. The failure mechanism is studied in detail to obtain a model that incorporates all significant stressing variables. For fatigue driven failure, Coffin-Manson equation...
Saved in:
Main Author: | Ng, Chee Weng |
---|---|
Format: | Thesis |
Language: | English |
Published: |
2005
|
Subjects: | |
Online Access: | http://eprints.utm.my/id/eprint/4369/1/NgCheeWengMFKM2005.pdf http://eprints.utm.my/id/eprint/4369/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer
by: Debnath , Sujan, et al.
Published: (2013) -
Mould Filling In Electronic Packaging
by: Heng, Chai Wei
Published: (2005) -
Mould Filling In Electronic Packaging
by: Chu, Wee Liang
Published: (2004) -
Development of Excel Based Reliability Model to Estimate
Life Distribution of Mechanical Seals
by: Ali, Lina Fahimah
Published: (2016) -
Damage mechanics-based model for reliability assessment of through-silicon via interconnects
by: Afripin, Mohammad Amirul Affiz
Published: (2020)