Mould Filling In Electronic Packaging
This final year project focuses on the study of flow in encapsulation processes of electronic packaging in an industry. The present study is using a program, which is written in Matlab language. Characteristic Based Split (CBS) method is utilized in this program to analyze and model the fluid...
Saved in:
| Main Author: | |
|---|---|
| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2005
|
| Subjects: | |
| Online Access: | http://eprints.usm.my/58163/1/Mould%20Filling%20In%20Electronic%20Packaging_Heng%20Chai%20Wei.pdf http://eprints.usm.my/58163/ |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|