Mould Filling In Electronic Packaging
This final year project focuses on the study of flow in encapsulation processes in electronic packaging industry. The present work adopted a 2D Hele-Shaw model to study the flow of Newtonian and Non-Newtonian (power law) fluids into cavities at various distances from transfer ram in the transf...
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| Format: | Monograph |
| Language: | English |
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Universiti Sains Malaysia
2004
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| Online Access: | http://eprints.usm.my/57100/1/Mould%20Filling%20In%20Electronic%20Packaging_Chu%20Wee%20Liang.pdf http://eprints.usm.my/57100/ |
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