Damage mechanics-based model for reliability assessment of through-silicon via interconnects
Through-silicon via (TSV) is one of the emerging technology enablers for the 3D Interconnects. TSV configuration consists of conductive materials, such as copper or tungsten, dielectric liner, which is silicon dioxide and silicon as the semiconductive material. The difference in thermal expansion ra...
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| Main Author: | |
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| Format: | Thesis |
| Language: | English |
| Published: |
2020
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| Online Access: | http://eprints.utm.my/id/eprint/102144/1/MohammadAmirulAffizAfripinPSKM2020.pdf.pdf http://eprints.utm.my/id/eprint/102144/ http://dms.library.utm.my:8080/vital/access/manager/Repository/vital:148372 |
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