Modelling Of Mechanical Behaviour Of Electronics Materials
Lead free solder Sn-Ag-Cu is investigated and studied to replace the leaded solder after the usage of lead components has been limited by Europe Union through the Restriction of Hazardous Substance (RoHS). Due to constant push on miniaturization in electronic package, strength of solder joint of ele...
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2019
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| Online Access: | http://eprints.usm.my/58428/1/Modelling%20Of%20Mechanical%20Behaviour%20Of%20Electronics%20Materials.pdf http://eprints.usm.my/58428/ |
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