Thermo-Mechanical Stress Analysis in Electronic Packaging with Continuous and Partial Bond Layer
Interfacial stress due to thermal mismatch in layered structure has been considered as one of the major causes of mechanical failure in electronic packaging. The mismatch due to the differences in coefficient of thermal expansion (CTE) of the materials in multi-layered stru...
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| Main Authors: | , , |
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| Format: | Citation Index Journal |
| Published: |
2013
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| Subjects: | |
| Online Access: | http://eprints.utp.edu.my/10617/1/Thermo%20mechanical%20stress%20analysis%20AMM.465-466.50.pdf http://eprints.utp.edu.my/10617/ |
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