Characterization of nickel plated copper heat spreaders with different catalytic activation processes for flip-chip ball grid array package

• Main Authors: Lim V., Ahmad I., Seng F.C., Amin N., Rasid R.
• Other Authors: 26432767800
• Format: Conference Paper
• Published: 2023
• Subjects: Electronics packaging; Flip chip devices; Heating equipment; Mixed convection; Nickel; Nickel alloys; Soldering alloys; Spreaders; Thermal diffusion; Thermal diffusivity; Activation techniques; After high temperature; Catalytic activation; Copper heat spreader; Copper layer; Copper strike; Flip chip; Flip chip ball grid array; Heat spreaders; High temperature storage test; Initial time; Intermetallic diffusion; Intermetallic layer; Pure copper; Semiconductor packages; Thermal Performance; Copper

This paper presents the effects of two different catalytic activation techniques on the thermal performance of flip chip heat spreaders. The two activation techniques investigated are i) thin nickel-copper strike and ii) galvanic initiation. Thermal diffusivity of these heat spreaders was studied us...