Holdings: The outcome of sintering parameters study toward the thermal properties of CuSiC composite

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Bibliographic Details
Main Authors:	Mohabattul Zaman, S NS Bukhari, Prof. Madya Ir., M.S.J. Hashmi, Dermot, Brabazon
Other Authors:	mzaman@unimap.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Coefficient of thermal expansion Copper Copper silicon carbide Electronic chips Integrated circuit Metal Matrix Composite (MMC) Packaging materials Powder metallurgy Silicon carbide (SiC) Sintering Thermal conductivity (TC)
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34467
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