Thermal expansion behavior of the electroless copper coated Cu-SiCp composites fabricated via the conventional powder metallurgical technique

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Bibliographic Details
Main Authors: Azmi, Kamardin, Mohd Nazree, Derman, Dr., Mohd Mustafa Al-Bakri, Abdullah, Sandu, A.V.
Other Authors: azmikamardin@unimap.edu.my
Format: Article
Language:English
Published: Trans Tech Publications 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/32671
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