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Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests

Drop ball reliability for Ball Grid Array (BGA) package on lead-free product is a major reliability concern. Integrating a polymer core in the solder ball could be a good strategy to dissipate stress better compared to the purely metallic solder ball. However, the diffusion rate of the copper is muc...

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書誌詳細
主要な著者:	Kar Y.B., Hui T.C., Agileswari R., Lo C.
その他の著者:	26649255900
フォーマット:	論文
出版事項:	2023
主題:	Copper Diffusion Drops Electronics packaging Intermetallics Nickel Polymers Reliability Testing Analytical software Ball grid array packages Comparison study Cu diffusion Diffusion rate Drop test Drop test reliability Drop-balls High temperature stress IMC thickness Kirkendall void Lead-free products Reliability performance Reliability test Solder ball shear Solder balls Solder joints Stress test Work study Soldering
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