Comparison study on reliability performance for polymer core solder balls under multiple reflow and HTS stress tests
Drop ball reliability for Ball Grid Array (BGA) package on lead-free product is a major reliability concern. Integrating a polymer core in the solder ball could be a good strategy to dissipate stress better compared to the purely metallic solder ball. However, the diffusion rate of the copper is muc...
Saved in:
| Main Authors: | , , , |
|---|---|
| Other Authors: | |
| Format: | Article |
| Published: |
2023
|
| Subjects: | |
| Tags: |
Add Tag
No Tags, Be the first to tag this record!
|