Aluminium surface grain size analysis on RIE treatment
Link to publisher's homepage at http://www.ttp.net/
Saved in:
Main Authors: | Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Fairul Afzal, Ahmad Fuad, Ehkan, Phaklen, Dr., Palianysamy, Moganraj, Aaron, Koay Terr Yeow |
---|---|
Other Authors: | zaliman@unimap.edu.my |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications (TTP)
2014
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/35370 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Interaction relationship analysis of surface roughness on aluminium etched wafer using RIE
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
Surface roughness analysis on reactive ion etched aluminium deposited wafer
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
Surface roughness scrutinizaton with RIE CF₄+Argon gaseous on platinum deposited wafer
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
Main effects study on plasma etched aluminium metallization
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
Surface roughness and wettability correlation on etched platinum using reactive ion ecthing
by: Zaliman, Sauli, Dr., et al.
Published: (2014)