Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
Link to publisher's homepage at http://www.ttp.net/
Saved in:
Main Authors: | Mohd Arif Anuar, Mohd Salleh, McDonald, Stuart D., Nogita, Kazuhiro |
---|---|
Other Authors: | k.nogita@uq.edu.au |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications
2014
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34845 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Effect of current stressing on intermetallic formation and mechanical properties of lead free SAC solder and SAC/activated carbon composite solder joint
by: Syahirah Alyaa, Yahya
Published: (2017) -
Intermetallic Compound (IMC) Analysis by Using Isothermal Aging Testing on Lead Free Solder
by: L.Chee Ping, Azrina A., et al.
Published: (2013) -
Research development of solder materials and its intermetallic compound (IMC) study
by: Mohd Arif Anuar, Mohd Salleh, et al.
Published: (2014) -
Research development of solder materials and its intermetallic compound (IMC) study
by: Mohd Arif Anuar, Mohd Salleh, et al.
Published: (2014) -
A comparative study of solder properties of Sn-0.7Cu lead-free solder fabricated via the powder metallurgy and casting methods
by: Mohd Arif Anuar, Mohd Salleh, et al.
Published: (2014)