Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review

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Main Authors: Mohd Arif Anuar, Mohd Salleh, McDonald, Stuart D., Nogita, Kazuhiro
Other Authors: k.nogita@uq.edu.au
Format: Article
Language:English
Published: Trans Tech Publications 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/34845
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spelling my.unimap-348452014-05-29T02:04:11Z Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review Mohd Arif Anuar, Mohd Salleh McDonald, Stuart D. Nogita, Kazuhiro k.nogita@uq.edu.au s.mcdonald@uq.edu.au arifanuar@unimap.edu.my Intermetallic Lead-free solder Mechanical mixing Powder metallurgy Link to publisher's homepage at http://www.ttp.net/ To increase the solder joint robustness, researches and studies on composite solder carried out by many researchers in an effort to develop viable lead-free solders which can replace the conventional lead-based solders. This paper reviews the fabrication processes of the lead free composite solder and its non-metal reinforcing effects to the suppression of intermetallic formation. Most researchers using different solder fabrication methods have found that by additions of non metal reinforcement from micron up to nano particle size had suppressed the intermetallic compound formations of lead-free composite solders. 2014-05-29T01:33:40Z 2014-05-29T01:33:40Z 2013 Article Applied Mechanics and Materials, vol.421, 2013, pages 260-266 978-303785878-3 16609336 http://www.scientific.net/AMM.421.260 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34845 10.4028/www.scientific.net/AMM.421.260 en Trans Tech Publications
institution Universiti Malaysia Perlis
building UniMAP Library
collection Institutional Repository
continent Asia
country Malaysia
content_provider Universiti Malaysia Perlis
content_source UniMAP Library Digital Repository
url_provider http://dspace.unimap.edu.my/
language English
topic Intermetallic
Lead-free solder
Mechanical mixing
Powder metallurgy
spellingShingle Intermetallic
Lead-free solder
Mechanical mixing
Powder metallurgy
Mohd Arif Anuar, Mohd Salleh
McDonald, Stuart D.
Nogita, Kazuhiro
Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
description Link to publisher's homepage at http://www.ttp.net/
author2 k.nogita@uq.edu.au
author_facet k.nogita@uq.edu.au
Mohd Arif Anuar, Mohd Salleh
McDonald, Stuart D.
Nogita, Kazuhiro
format Article
author Mohd Arif Anuar, Mohd Salleh
McDonald, Stuart D.
Nogita, Kazuhiro
author_sort Mohd Arif Anuar, Mohd Salleh
title Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
title_short Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
title_full Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
title_fullStr Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
title_full_unstemmed Non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
title_sort non-metal reinforced lead-free composite solder fabrication methods and its reinforcing effects to the suppression of intermetallic formation: short review
publisher Trans Tech Publications
publishDate 2014
url http://dspace.unimap.edu.my:80/dspace/handle/123456789/34845
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score 13.18916