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Extended reliability of gold and copper ball bonds in microelectronic packaging

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書誌詳細
主要な著者:	Chong, Leong Gan, Classe, Francis, Bak, Lee Chan, Uda, Hashim, Prof. Dr.
その他の著者:	chong-leong.gan@spansion.com
フォーマット:	論文
言語:	English
出版事項:	World Gold Council 2014
主題:	Copper bonding wire Extended reliability Gold bonding wire Microelectronic packaging Silver wire
オンライン･アクセス:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33097
タグ:	タグ追加タグなし, このレコードへの初めてのタグを付けませんか!

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