APA Citation

Chong, L. G., & chong-leong.gan@spansion.com. (2014). Extended reliability of gold and copper ball bonds in microelectronic packaging. World Gold Council.

Chicago Style Citation

Chong, Leong Gan, and chong-leong.gan@spansion.com. Extended Reliability of Gold and Copper Ball Bonds in Microelectronic Packaging. World Gold Council, 2014.

MLA Citation

Chong, Leong Gan, and chong-leong.gan@spansion.com. Extended Reliability of Gold and Copper Ball Bonds in Microelectronic Packaging. World Gold Council, 2014.

Warning: These citations may not always be 100% accurate.