Curing profile optimization of silver epoxy die attach in ball grid array package process / Ng Qian Qing
Ball grid array (BGA) packages are essential components in automotive applications, renowned for their compact form factor and high-density interconnections. However, the persistent issue of void formation within these packages poses a significant challenge to their performance and reliability. This...
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Main Author: | Ng , Qian Qing |
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Format: | Thesis |
Published: |
2024
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Subjects: | |
Online Access: | http://studentsrepo.um.edu.my/15386/2/Ng_Qian_Qing.pdf http://studentsrepo.um.edu.my/15386/1/Ng_Qian_Qing.pdf http://studentsrepo.um.edu.my/15386/ |
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