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Diffusion mechanism of silver particles in polymer binder for die attach interconnect technology

Sintered Ag has gained strong interest as an important alternative material for interconnect technology in wide bandgap (WBG) semiconductor industries specifically for high thermal dissipations and high-speed applications. This material typically consists of metallic particles bounded by polymer bin...

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Bibliographic Details
Main Authors: Omar, Ghazali, Esa, Siti Rahmah, Sheikh Md Fadzullah, Siti Hajar, Siow, Kim Shyong, Abdul Rahim, Bazura, Cosut, Bunyemin
Format: Article
Language:English
Published: Universiti Malaysia Perlis 2020
Online Access:http://eprints.utem.edu.my/id/eprint/24862/2/VOL_13_SI_MEI2020_461-472.PDF
http://eprints.utem.edu.my/id/eprint/24862/
https://ijneam.unimap.edu.my/images/PDF/IJNEAM%20SPECIAL%20ISSUE%20MEI%202020/Vol_13_SI_Mei2020_461-472.pdf
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http://eprints.utem.edu.my/id/eprint/24862/2/VOL_13_SI_MEI2020_461-472.PDF
http://eprints.utem.edu.my/id/eprint/24862/
https://ijneam.unimap.edu.my/images/PDF/IJNEAM%20SPECIAL%20ISSUE%20MEI%202020/Vol_13_SI_Mei2020_461-472.pdf

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