Evaluation of different die attach film and epoxy pastes for stacked die QFN package

• Main Authors: Ahmad, I., Bachok, N.N., Chiang, N.C., Talib, M.Z.M., Rosle, M.F., Latip, F.L.A., Aziz, Z.A.
• 出版: 2017
• 在線閱讀: http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5291

The trend in the semiconductor industry is to develop more powerful components while decreasing the component size. A suitable material set has to be obtained for the required reliability performance. The objective of this study is to evaluate the performance of different die attach film (DAF) and e...