Performance of a hybrid fine pitch quad flat package mounted with a new flux on printed circuit board in surface insulation resistance test

• Main Authors: Zhou, Ding, Haseeb, A.S. Md. Abdul, Andriyana, Andri, Wong, Yew Hoong, Sabri, Mohd Faizul Mohd, Low, B.Y., Pang, X.S., Eu, P.L., Tan, L.C.
• Format: Article
• Published: Wiley-VCH Verlag 2020
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.um.edu.my/25697/; https://doi.org/10.1002/mawe.202000064

An innovative hybrid quad flat package is designed recently by incorporating two types of leads with two distinctive shapes: gull wing and J-lead. These leads are separated into two layers to increase the adjacent space between them. Pure tin is used as the connector finish in the package, while Sn-...