Ultra fine pitch 20 micron 2N second bond improvement with new capillary surface morphology
Wire bonding of 20micron 2N wire using conventional pink capillary for ultra Fine Pitch package results in high stoppages of short tail which causes machine to stop, higher yield loss and reduced equipment efficiency and stability. The objective of present study is to improve the 2nd bond quality an...
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| Main Authors: | , , , |
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| Published: |
2017
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| Online Access: | http://dspace.uniten.edu.my:8080/jspui/handle/123456789/5264 |
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