Comparison of performance of no-clean and water-soluble fluxes in fine-pitch flip-chip package / Saif Wakeel
The complexity of cleaning caused by miniaturization of electronic packages and the drive towards cost reduction have recently led to the development of no-clean fluxes (NCF). In this study, characterization and effect of two commercial NCF namely NC-1 and NC-2 on the fine pitch flip-chip package we...
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| Format: | Thesis |
| Published: |
2021
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| Online Access: | http://studentsrepo.um.edu.my/13581/1/Saif_Wakeel.jpg http://studentsrepo.um.edu.my/13581/8/saif.pdf http://studentsrepo.um.edu.my/13581/ |
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