The analysis on functionality of composite solder oxidize copper lead frame interconnect in microelectronic packaging
Recently, the attention toward CNT-composite solder (CCS) has increased remarkably due to numerous advantages. However, the electronic devices’ failure is still growing and has become an integral part of the countless product in the industrial market. These failures are mainly related to the reliabi...
Saved in:
Main Author: | Ahmad, Intan Fatihah |
---|---|
Format: | Thesis |
Language: | English English |
Published: |
2022
|
Subjects: | |
Online Access: | http://eprints.utem.edu.my/id/eprint/26873/1/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf http://eprints.utem.edu.my/id/eprint/26873/2/The%20analysis%20on%20functionality%20of%20composite%20solder%20oxidize%20copper%20lead%20frame%20interconnect%20in%20microelectronic%20packaging.pdf http://eprints.utem.edu.my/id/eprint/26873/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=122194 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Dynamic fracture process of solder/intermetallic interface in lead-free solder interconnects using cohesive zone model
by: Mohd. Yamin, Aliff Farhan
Published: (2012) -
Mechanics of solder/IMC interface of lead-free solder interconnects in ball grid array assembly
by: Asasaari, S. F. M., et al.
Published: (2022) -
Classical and damage mechanics-based models for lead-free solder interconnects
by: Lai, Zheng Bo
Published: (2009) -
Temperature and strain-rate dependent damage-based models for lead-free solder interconnects
by: Mad Asasaari, Siti Faizah
Published: (2021) -
Modeling Of Vertical Side Chip Interconnect Technology For 3-Dimensional Packaging
by: Tan , Ai Heong
Published: (2015)