Electromigration damage in lead-free solder joints prepared using metallic nanoparticle doped flux / Muhammad Nasir
Miniaturization of microelectronic devices and the associated increase in current density during operation raise concerns over electromigration (EM) damage in solder joints. This thesis focuses on the effects of Ni and Co nanoparticle (NP) doped flux on the microstructure, mechanical and electrical...
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| Format: | Thesis |
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2017
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| Online Access: | http://studentsrepo.um.edu.my/8112/1/All.pdf http://studentsrepo.um.edu.my/8112/6/nasir.pdf http://studentsrepo.um.edu.my/8112/ |
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