Mould Filling In Electronic Packaging
This final year project focuses on the study of flow in encapsulation processes in electronic packaging industry. The present work adopted a 2D Hele-Shaw model to study the flow of Newtonian and Non-Newtonian (power law) fluids into cavities at various distances from transfer ram in the transf...
Saved in:
Main Author: | Chu, Wee Liang |
---|---|
Format: | Monograph |
Language: | English |
Published: |
Universiti Sains Malaysia
2004
|
Subjects: | |
Online Access: | http://eprints.usm.my/57100/1/Mould%20Filling%20In%20Electronic%20Packaging_Chu%20Wee%20Liang.pdf http://eprints.usm.my/57100/ |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Mould Filling In Electronic Packaging
by: Heng, Chai Wei
Published: (2005) -
Modeling and evaluation of the filling stage of
injection/compression moulding
by: Bickerton, Simon, et al.
Published: (2003) -
Effect of runner dimensions on cavity filling in microinjection moulding for defect-free parts
by: Abdullahi, A.A., et al.
Published: (2016) -
Development of indirect rapid tooling inserts using metal filled epoxy for injection moulding process
by: Sharif, Safian, et al.
Published: (2018) -
Mechanism-based reliability model for electronic packages
by: Ng, Chee Weng
Published: (2005)