Mould Filling In Electronic Packaging
This final year project focuses on the study of flow in encapsulation processes in electronic packaging industry. The present work adopted a 2D Hele-Shaw model to study the flow of Newtonian and Non-Newtonian (power law) fluids into cavities at various distances from transfer ram in the transf...
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| Main Author: | |
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| Format: | Monograph |
| Language: | English |
| Published: |
Universiti Sains Malaysia
2004
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| Online Access: | http://eprints.usm.my/57100/1/Mould%20Filling%20In%20Electronic%20Packaging_Chu%20Wee%20Liang.pdf http://eprints.usm.my/57100/ |
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| Summary: | This final year project focuses on the study of flow in encapsulation processes in electronic
packaging industry. The present work adopted a 2D Hele-Shaw model to study the flow of
Newtonian and Non-Newtonian (power law) fluids into cavities at various distances from
transfer ram in the transfer molding process. The velocity field obtained from both
Hele-Shaw and generalized porous medium approaches is used in pseudo-concentration
algorithm for front tracking with an artificial diffusion term added to allow partial slip at
the fluid-wall interface and to damp numerical oscillation to a minimum level. Finite
Element Method is employed in all the analyses to reduce the governing partial differential
equations to algebraic equations. Parametric studies had been carried out to study how the
dimension and parameter of the mold tools affects the flow filling’s behavior. From
parametric study we can show that by altering the dimensions of mold tools, thus
introducing different hydraulic resistances at various in-line cavities in appropriate
proportions, will lead to balance filling in transfer molding. |
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