Interfacial reaction of Bi–Ag and Bi–Sb solders on copper substrate with multiple reflow number
Owing to the toxicity of lead, much effort has been put in studies on lead-free solders after environmental legislations prohibited the use of lead in these parts worldwide. Here, Bi–Ag and Bi–Sb alternative solder alloys containing 1·5–5 wt-% Ag and Sb were investigated. The effect of the reflow nu...
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| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
W. S. Maney & Son
2014
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| Online Access: | http://psasir.upm.edu.my/id/eprint/34236/1/Interfacial%20reaction%20of%20Bi%E2%80%93Ag%20and%20Bi%E2%80%93Sb%20solders%20on%20copper%20substrate%20with%20multiple%20reflow%20number.pdf http://psasir.upm.edu.my/id/eprint/34236/ http://tandfonline.com/doi/full/10.1179/1432891714Z.000000000976 |
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