Microstructural evaluation of Bi-Ag and Bi-Sb lead-free high-temperature solder candidates on copper substrate with multiple reflow number

• Main Authors: Nahavandi, Mahdi, Mohamed Ariff, Azmah Hanim, Zahari, Nur Ismarrubie, Baserfalak, F.
• Format: Article
• Language: English
• Published: Trans Tech Publications 2014
• Online Access: http://psasir.upm.edu.my/id/eprint/34519/1/Microstructural%20evaluation%20of%20Bi-Ag%20and%20Bi-Sb%20lead-free%20high-temperature%20solder%20candidates%20on%20copper%20substrate%20with%20multiple%20reflow%20number.pdf; http://psasir.upm.edu.my/id/eprint/34519/; http://www.scientific.net/AMM.564.388

An impetus has been provided towards the development of lead-free solders by worldwide environmental legislation that banned the use of lead in solders due to the lead toxicity. This study focus on Bi-Ag and Bi-Sb solder alloys, in compositions from 1.5 to 5 wt % Ag and Sb. The effects of Ag and Sb...