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Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder

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Bibliographic Details
Main Authors:	Mohd Arif Anuar, Mohd Salleh, Somidin, Flora, Nik Noriman, Zulkepli, Dr., Khairel Rafezi, Ahmad, Dr., Mayappan, Ramani, Noor Farhani, Mohd Alui
Other Authors:	arifanuar@unimap.edu.my
Format:	Article
Language:	English
Published:	Trans Tech Publications 2014
Subjects:	Lead-free composite solder Melting temperature Recycled-Aluminium
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/34846
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