Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder
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Main Authors: | Mohd Arif Anuar, Mohd Salleh, Somidin, Flora, Nik Noriman, Zulkepli, Dr., Khairel Rafezi, Ahmad, Dr., Mayappan, Ramani, Noor Farhani, Mohd Alui |
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Other Authors: | arifanuar@unimap.edu.my |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications
2014
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Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/34846 |
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