Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder
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Trans Tech Publications
2014
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my.unimap-348462014-05-29T01:58:04Z Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder Mohd Arif Anuar, Mohd Salleh Somidin, Flora Nik Noriman, Zulkepli, Dr. Khairel Rafezi, Ahmad, Dr. Mayappan, Ramani Noor Farhani, Mohd Alui arifanuar@unimap.edu.my niknoriman@unimap.edu.my rafezi@unimap.edu.my ramani@perlis.uitm.edu.my Lead-free composite solder Melting temperature Recycled-Aluminium Link to publisher's homepage at http://www.ttp.net/ Composite approach in lead-free solder development was perceived as an expectation in finding new robust solder. Accordingly, Sn-0.7Cu/re-Al composite lead-free solder with varying amount of recycled-Aluminium (0, 3.0, 3.5 and 4.0 wt. % re-Al) particulates produced from aluminium beverage cans were successfully fabricated via powder metallurgy techniques in this study. This paper focuses on the thermal properties focusing on the melting temperature of the new developed Sn-0.7Cu/re-Al lead-free composite solder. The melting temperature (Tm) of the new solders was determined using differential scanning calorimetry (DSC). The melting temperature of the composite solders has showed comparable results with the monolithic solders of Sn-0.7Cu lead-free solder. 2014-05-29T01:58:04Z 2014-05-29T01:58:04Z 2013 Article Advanced Materials Research, vol.795, 2013, pages 451-454 978-303785811-0 1022-6680 (Print) 1662-8985 (Online) http://www.scientific.net/AMR.795.451 http://dspace.unimap.edu.my:80/dspace/handle/123456789/34846 10.4028/www.scientific.net/AMR.795.451 en Trans Tech Publications |
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English |
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Lead-free composite solder Melting temperature Recycled-Aluminium |
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Lead-free composite solder Melting temperature Recycled-Aluminium Mohd Arif Anuar, Mohd Salleh Somidin, Flora Nik Noriman, Zulkepli, Dr. Khairel Rafezi, Ahmad, Dr. Mayappan, Ramani Noor Farhani, Mohd Alui Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder |
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Link to publisher's homepage at http://www.ttp.net/ |
| author2 |
arifanuar@unimap.edu.my |
| author_facet |
arifanuar@unimap.edu.my Mohd Arif Anuar, Mohd Salleh Somidin, Flora Nik Noriman, Zulkepli, Dr. Khairel Rafezi, Ahmad, Dr. Mayappan, Ramani Noor Farhani, Mohd Alui |
| format |
Article |
| author |
Mohd Arif Anuar, Mohd Salleh Somidin, Flora Nik Noriman, Zulkepli, Dr. Khairel Rafezi, Ahmad, Dr. Mayappan, Ramani Noor Farhani, Mohd Alui |
| author_sort |
Mohd Arif Anuar, Mohd Salleh |
| title |
Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder |
| title_short |
Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder |
| title_full |
Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder |
| title_fullStr |
Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder |
| title_full_unstemmed |
Thermal properties of Sn-0.7Cu/re-Al composite lead-free solder |
| title_sort |
thermal properties of sn-0.7cu/re-al composite lead-free solder |
| publisher |
Trans Tech Publications |
| publishDate |
2014 |
| url |
http://dspace.unimap.edu.my:80/dspace/handle/123456789/34846 |
| _version_ |
1643797616718249984 |
| score |
13.2014675 |