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Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization

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Main Authors:	Goh, Teck Joo, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Ganeshamoorthy, K. Jeevan
其他作者:	teck.joo.goh@intel.com
格式:	Article
語言:	English
出版:	Emerald Group Publishing Limited 2014
主題:	Dissipation factor Finite element analysis Programming and algorithm theory Regression analysis
在線閱讀:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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