Holdings: Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization

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Bibliographic Details
Main Authors:	Goh, Teck Joo, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Ganeshamoorthy, K. Jeevan
Other Authors:	teck.joo.goh@intel.com
Format:	Article
Language:	English
Published:	Emerald Group Publishing Limited 2014
Subjects:	Dissipation factor Finite element analysis Programming and algorithm theory Regression analysis
Online Access:	http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947
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