Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization

• Main Authors: Goh, Teck Joo, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Ganeshamoorthy, K. Jeevan
• 其他作者: [e-mail]
• 格式: Article
• 語言: English
• 出版: Emerald Group Publishing Limited 2014
• 主題: Dissipation factor; Finite element analysis; Programming and algorithm theory; Regression analysis
• 在線閱讀: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947

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