Goh, T. J., & teck.joo.goh@intel.com. (2014). Thermal investigations of microelectronic chip with non-uniform power distribution: Temperature prediction and thermal placement design optimization. Emerald Group Publishing Limited.
Chicago Style CitationGoh, Teck Joo, and teck.joo.goh@intel.com. Thermal Investigations of Microelectronic Chip With Non-uniform Power Distribution: Temperature Prediction and Thermal Placement Design Optimization. Emerald Group Publishing Limited, 2014.
MLA CitationGoh, Teck Joo, and teck.joo.goh@intel.com. Thermal Investigations of Microelectronic Chip With Non-uniform Power Distribution: Temperature Prediction and Thermal Placement Design Optimization. Emerald Group Publishing Limited, 2014.
Warning: These citations may not always be 100% accurate.