Thermal investigations of microelectronic chip with non-uniform power distribution: temperature prediction and thermal placement design optimization

• Main Authors: Goh, Teck Joo, Seetharamu, Kankanhally N., Ghulam, Abdul Quadir, Prof. Dr., Zainal Alimuddin, Zainal Alauddin, Dr., Ganeshamoorthy, K. Jeevan
• Other Authors: [e-mail]
• Format: Article
• Language: English
• Published: Emerald Group Publishing Limited 2014
• Subjects: Dissipation factor; Finite element analysis; Programming and algorithm theory; Regression analysis
• Online Access: http://dspace.unimap.edu.my:80/dspace/handle/123456789/33947

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