Polymer core BGA stress analysis at minimal vertical loading
Link to publisher's homepage at http://www.ttp.net/
Saved in:
Main Authors: | Zaliman, Sauli, Dr., Retnasamy, Vithyacharan, Steven, Taniselass, Norazeani, Abdul Rahman, Muhamad Hafiz, Ab Aziz |
---|---|
Other Authors: | zaliman@unimap.edu.my |
Format: | Article |
Language: | English |
Published: |
Trans Tech Publications
2014
|
Subjects: | |
Online Access: | http://dspace.unimap.edu.my:80/dspace/handle/123456789/32660 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Temperature cycling test for a Ball Grid Array (BGA) package using finite element analysis (FEA)
by: Muhammad Nubli, Zulkifli
Published: (2019) -
Shear speed analysis on Sn-3.9Ag-0.6Cu Solder
by: Zaliman, Sauli, Dr., et al.
Published: (2014) -
Application of statistical methods to reduce the defect of assembly process for plastic ball grid array (PBGA) component
by: Tan, Chun Huat
Published: (2014) -
Temperature cycling reliability test for a ball grid array (BGA) package using finite element analysis (FEA)
by: Muhammad Nubli, Zulkifli
Published: (2010) -
Optimization of novel two-step curing method for die stack epoxy bonding to reduce voids in Ball Grid Array packages for high-density interconnect applications
by: Ng Q.Q., et al.
Published: (2025)