Ionic contaminations level and cleaning flip chip BGA package via a new cleaning solvent technology

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Bibliographic Details
Main Authors: Yap, Boon Kar, Dr., Noor Azrina, Talik, Zaliman, Sauli, Dr., Foong, Chee Seng, Tan, Chou Yong, Dr., Retnasamy, Vithyacharan
Other Authors: kbyap@uniten.edu.my
Format: Article
Language:English
Published: Emerald Group Publishing Limited 2014
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Online Access:http://dspace.unimap.edu.my:80/dspace/handle/123456789/33932
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