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Thermal model with metal consideration for System-On-Chip testing

Increasing switching activities leads to high temperature during testing, which has adverse impact on circuit performance and reliability. Therefore, simulating thermal effects on System-on-Chip (SoC) when performing test scheduling is essential. However, most of the previous works on temperatureawa...

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書目詳細資料
Main Authors:	Abu Hassan, Hasliza, Ooi, Chia Yee
格式:	Article
出版:	American Scientific Publishers 2014
主題:	T Technology
在線閱讀:	http://eprints.utm.my/id/eprint/63055/ http://dx.doi.org/10.1166/jolpe.2014.1330
標簽:	添加標簽沒有標簽, 成為第一個標記此記錄!

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