Reducing Void During Transfer Moulding Of Semiconductor Plastic Package Using
Transfer moulding is a process that generally used at an assembly area in the electronics industry, specifically in the semiconductor plastic packaging industry. This is because the transfer moulding uses an Epoxy Moulding Compound (EMC) material to encapsulate the chip and wire bond that attached t...
Saved in:
Main Author: | Zainul Hashimi, Faridah |
---|---|
Format: | Thesis |
Language: | English English |
Published: |
2019
|
Subjects: | |
Online Access: | http://eprints.utem.edu.my/id/eprint/24952/1/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf http://eprints.utem.edu.my/id/eprint/24952/2/Reducing%20Void%20During%20Transfer%20Moulding%20Of%20Semiconductor%20Plastic%20Package%20Using.pdf http://eprints.utem.edu.my/id/eprint/24952/ https://plh.utem.edu.my/cgi-bin/koha/opac-detail.pl?biblionumber=117932 |
Tags: |
Add Tag
No Tags, Be the first to tag this record!
|
Similar Items
-
Optimization of plastic mould conformal cooling for increasing production rate of plastic product
by: Hasmi, Ahmad Hazlan
Published: (2013) -
Injection Moulding: Warpage Reduction By Reducing Residual Stress
by: Voo, Chuang Sin
Published: (2015) -
An analysis on reducing defect rate in moulding process of phone casing
by: Norliza Zafira, Razali
Published: (2013) -
Injection Moulding Processing Analysis of Polylactic Acid And Low-Density Polyethylene Plastic Spoon
by: Wong, Qin Yan
Published: (2012) -
Development Of Biodegradable Plastics For Packaging Using Wastes From Oil Palm And Sugar Cane
by: Wahid, Mohammad Khalid, et al.
Published: (2019)