Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance
In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct deposition of metal on IC mold compound is des...
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| Main Authors: | , , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/14856/1/Paper.pdf http://eprints.utem.edu.my/id/eprint/14856/ http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6920860&tag=1 |
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