Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance

In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct deposition of metal on IC mold compound is des...

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Bibliographic Details
Main Authors: Tai, Min Fee, Lee, Swee Kah, Goh, Soon Lock, Kok, Swee Leong, Kenichiroh, Mukai, Tafadwa, Magaya
Format: Conference or Workshop Item
Language:English
Published: 2014
Subjects:
Online Access:http://eprints.utem.edu.my/id/eprint/14856/1/Paper.pdf
http://eprints.utem.edu.my/id/eprint/14856/
http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6920860&tag=1
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