Rate-dependent responses of electroless plated and sputtered copper layer during nanoindentation loading

• Main Authors: Afripin, M.A.A., Fadil, N.A., Hamid, M.F.A., Yoon, C.K., Cheah, B.E., Razak, B.B.A., Tamin, M.N.
• Format: Conference or Workshop Item
• Published: Institute of Electrical and Electronics Engineers Inc. 2016
• Subjects: TJ Mechanical engineering and machinery
• Online Access: http://eprints.utm.my/id/eprint/72956/; https://www.scopus.com/inward/record.uri?eid=2-s2.0-85005950996&doi=10.1109%2fIEMT.2016.7761957&partnerID=40&md5=e05a8553bf7e8695f929487f8d513266

A thin copper layer is an integral part of a Through-Silicon via (TSV) structure. The copper layer experiences mechanical stressing through the temperature excursion, thus raising reliability concern of the component. Such reliability assessment calls for the determination of the mechanical properti...