Effect of hydrofluoric acid etching on electroless copper plating on silicon wafer
Metallic coating such as copper film can be easily deposited on the semiconductor materials like silicon wafer substrate without prior surface pre-treatment. However, the adhesion of the copper film was very weak and easily peels off. In this study, the effect of etching in hydrofluoric acid solutio...
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| Main Authors: | , |
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| Format: | Conference or Workshop Item |
| Published: |
2015
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| Subjects: | |
| Online Access: | http://eprints.utm.my/id/eprint/62148/ http://www.icamt.net/ |
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