Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance
In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct deposition of metal on IC mold compound is des...
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my.utem.eprints.148562015-09-29T03:37:27Z http://eprints.utem.edu.my/id/eprint/14856/ Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance Tai, Min Fee Lee, Swee Kah Goh, Soon Lock Kok, Swee Leong Kenichiroh, Mukai Tafadwa, Magaya TK Electrical engineering. Electronics Nuclear engineering In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct deposition of metal on IC mold compound is desirable. Conventional metal plating techniques, however fail tape test. This paper studies the condition of plating metal directly onto surface of mold compound with the enhancement of novel non-etching adhesion promoter CovaBond MRTM. By plating direct onto mold compound, the shielding capping task can be done in array form before the die saw process in IC manufacturing (before IC assembly), which reduce the thickness and dimension of chip and improves design flexibility of circuit board as well as reduce the manufacturing cost. The industrial test results in this paper have proven the performance of the enhanced metal plating technique. 2014 Conference or Workshop Item PeerReviewed text en http://eprints.utem.edu.my/id/eprint/14856/1/Paper.pdf Tai, Min Fee and Lee, Swee Kah and Goh, Soon Lock and Kok, Swee Leong and Kenichiroh, Mukai and Tafadwa, Magaya (2014) Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance. In: IEEE International Conference on Semiconductor Electronics (ICSE), , 27-29 Aug. 2014, Kuala Lumpur. http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6920860&tag=1 |
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TK Electrical engineering. Electronics Nuclear engineering Tai, Min Fee Lee, Swee Kah Goh, Soon Lock Kok, Swee Leong Kenichiroh, Mukai Tafadwa, Magaya Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance |
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In the manufacturing process, metal capping for
EMI shielding is done during the integrated circuit (IC)
assembly process, which hinders the attempt of reducing
the size of electronic device and also incurs higher cost of
assembly. Therefore direct deposition of metal on IC mold
compound is desirable. Conventional metal plating
techniques, however fail tape test. This paper studies the
condition of plating metal directly onto surface of mold
compound with the enhancement of novel non-etching
adhesion promoter CovaBond MRTM. By plating direct
onto mold compound, the shielding capping task can be
done in array form before the die saw process in IC
manufacturing (before IC assembly), which reduce the
thickness and dimension of chip and improves design
flexibility of circuit board as well as reduce the
manufacturing cost. The industrial test results in this
paper have proven the performance of the enhanced metal
plating technique. |
format |
Conference or Workshop Item |
author |
Tai, Min Fee Lee, Swee Kah Goh, Soon Lock Kok, Swee Leong Kenichiroh, Mukai Tafadwa, Magaya |
author_facet |
Tai, Min Fee Lee, Swee Kah Goh, Soon Lock Kok, Swee Leong Kenichiroh, Mukai Tafadwa, Magaya |
author_sort |
Tai, Min Fee |
title |
Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance |
title_short |
Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance |
title_full |
Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance |
title_fullStr |
Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance |
title_full_unstemmed |
Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance |
title_sort |
adhesion enhancement for electroless plating on mold compound for emi shielding with industrial test compliance |
publishDate |
2014 |
url |
http://eprints.utem.edu.my/id/eprint/14856/1/Paper.pdf http://eprints.utem.edu.my/id/eprint/14856/ http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6920860&tag=1 |
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1665905615709405184 |
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13.18916 |