Adhesion enhancement for electroless plating on mold compound for EMI shielding with industrial test compliance
In the manufacturing process, metal capping for EMI shielding is done during the integrated circuit (IC) assembly process, which hinders the attempt of reducing the size of electronic device and also incurs higher cost of assembly. Therefore direct deposition of metal on IC mold compound is des...
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| Main Authors: | , , , , , |
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| Format: | Conference or Workshop Item |
| Language: | English |
| Published: |
2014
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| Subjects: | |
| Online Access: | http://eprints.utem.edu.my/id/eprint/14856/1/Paper.pdf http://eprints.utem.edu.my/id/eprint/14856/ http://ieeexplore.ieee.org/xpls/abs_all.jsp?arnumber=6920860&tag=1 |
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| Summary: | In the manufacturing process, metal capping for
EMI shielding is done during the integrated circuit (IC)
assembly process, which hinders the attempt of reducing
the size of electronic device and also incurs higher cost of
assembly. Therefore direct deposition of metal on IC mold
compound is desirable. Conventional metal plating
techniques, however fail tape test. This paper studies the
condition of plating metal directly onto surface of mold
compound with the enhancement of novel non-etching
adhesion promoter CovaBond MRTM. By plating direct
onto mold compound, the shielding capping task can be
done in array form before the die saw process in IC
manufacturing (before IC assembly), which reduce the
thickness and dimension of chip and improves design
flexibility of circuit board as well as reduce the
manufacturing cost. The industrial test results in this
paper have proven the performance of the enhanced metal
plating technique. |
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